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Wafers

We produce bespoke wafers out of fused silica, sapphire, N-BK7, SiC or other materials. Even highest standards and special requirements can be met. Contact us!

Material

fused silica, sapphire, N-BK7, N-LASF, N-SF6, SiC and more

Dimensions

Round plates:Ø 50.8 - 254mm

Tolerances

Thickness :up to ± 0.001 mm
Outer dimension:up to ±0.01mm
Edge length:up to ±0.01mm
Flatness:Bow, Warp, TTV upon request and depending on size

Further dimensions and specifications upon request. Please contact us for your customized quote!

 

Tanja Ruiters

Tanja Ruiters

Internal Sales Optics

+49 (0)30 5858428 18
tanja.ruiters@dopa-diatools.com

Jens Müller

Jens Müller

Head of Business Unit & Sales Optics

+49 (0)30 5858428 41
jens.mueller@dopa-diatools.com

If you have any questions or would like further information, please do not hesitate to contact us.