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Wafers
We produce bespoke wafers out of fused silica, sapphire, N-BK7, SiC or other materials. Even highest standards and special requirements can be met. Contact us!
Material
fused silica, sapphire, N-BK7, N-LASF, N-SF6, SiC and more
Dimensions
Round plates: | Ø 50.8 - 254mm |
Tolerances
Thickness : | up to ± 0.001 mm |
Outer dimension: | up to ±0.01mm |
Edge length: | up to ±0.01mm |
Flatness: | Bow, Warp, TTV upon request and depending on size |
Further dimensions and specifications upon request. Please contact us for your customized quote!
![Tanja Ruiters](https://www.dopa-diatools.com/wp-content/uploads/2021/11/Tanja-Ruiters.jpg)
![Jens Müller](https://www.dopa-diatools.com/wp-content/uploads/2019/08/Jens-Müller.jpg)
If you have any questions or would like further information, please do not hesitate to contact us.