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Polishing Pads

Polishing Pads

With dopa polishing pads you will achieve superior flatness, material removal rate (MRR) and surface
quality on materials like glass, sapphire, silicon carbide and other ultra-hard carbides and nitrides.

The dopa GP-1 works with Silica CMP slurries as well as with diamond slurries. You will achieve the best process results when using the pad in combination with dopa polishing slurries.

Tabelle: Übersicht Poliertücher

Customized grooving and slurry holes available upon request.

Benefits of polishing pads

  • High material removal rate (MRR)
  • Excellent (with GP1, WP2-7) /good (with BP2) part flatness and TTV
  • Improves the surface finish and the subsurface damage of your parts
  • Minimizes edge-rounding and orange-peel
  • Keeps the removal rate stable giving you better process control
  • Very durable pad with long lifetime
Olga Stark

Olga Stark

Internal Sales for Tools, Machines & Consumables

+49 (0)30 5858428 32

Jürgen Waidhas

Jürgen Waidhas

Sales Engineer for Tools, Machines & Consumables

Mario Patraschkov

Mario Patraschkov

Head of Sales Tools, Machines & Consumables

+49 (0)30 5858428 31

If you have any questions or would like further information, please do not hesitate to contact us.