Double-sided Machines

Double-sided Machines for Grinding and Polishing

We also offer double-sided grinding, lapping and polishing machines. Working 30 years in the development and production of diamond tooling as well as producing precision optics and semiconductor substrates gives us the background to understand your requirements and transfer them into the needed machine.

Please contact us to discuss your specifications.

To DXM-1500

To DXM-750

Advantages of dopa Double-Sided Machines

Automatic thickness measurement and tracking of component thicknesses (only for grinding and lapping machines)
Automatic pressure control
Online tracking of temperatures, torques, and pressures
Robust machine with a very small footprint
Temperature- and flow-controlled media supply
Easy cleaning and maintenance of the entire machine
Automatic disk cleaning unit
User-friendly dopa software with high flexibility for adapting to specific requirements