Double-sided Machines for Grinding and Polishing
We also offer double-sided grinding, lapping and polishing machines. Working 30 years in the development and production of diamond tooling as well as producing precision optics and semiconductor substrates gives us the background to understand your requirements and transfer them into the needed machine.
Please contact us to discuss your specifications.
Advantages of dopa Double-Sided Machines
- Automatic thickness measurement and tracking of component thicknesses (only for grinding and lapping machines)
-
Automatic pressure control
-
Online tracking of temperatures, torques, and pressures
-
Robust machine with a very small footprint
-
Temperature- and flow-controlled media supply
-
Easy cleaning and maintenance of the entire machine
-
Automatic disk cleaning unit
-
User-friendly dopa software with high flexibility for adapting to specific requirements
Olga Stark
Internal Sales for Tools, Machines & Consumables
+49 (0)30 5858428 32
olga.stark@dopa-diatools.com
Jürgen Waidhas
Global Sales for Tools and Machines
+49 (0)1624012599
juergen.waidhas@dopa-diatools.com
Mario Patraschkov
Head of Sales Tools, Machines & Consumables
+49 (0)30 5858428 31
mario@dopa-diatools.com
Please do not hesitate to contact us. We would gladly support you with our expertise and customize the machines to your needs.
