Polishing Pads

Polishing Pads

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Polishing Pads

Polishing Pads

With dopa polishing pads you will achieve superior flatness, material removal rate (MRR) and surface quality on materials like glass, sapphire, silicon carbide and other ultra-hard carbides and nitrides.

The dopa GP-1 works with Silica CMP slurries as well as with diamond slurries. You will achieve the best process results when using the pad in combination with dopa polishing slurries.

Table: Overview polishing pads

Customized grooving and slurry holes available upon request

Benefits of polishing pads

  • Hohe Abtragsraten (MRR)
  • Exzellente (mit GP1, WP2-7) bzw. gute (mit BP2) Ebenheit und TTV der bearbeiteten Komponenten
  • Verbessert die Oberflächengüte und minimiert die Tiefenschädigung Ihrer Bauteile
  • Erheblich verringerte Orangenhaut und Abrundung von Kanten
  • Kompatibel mit Silizium-CMP-Suspensionen im Nanometerbereich und Diamantsuspensionen
  • Gleichbleibende Abtragsraten, welche Ihnen eine bessere Prozesskontrolle ermöglichen
  • Sehr beständiges Tuch mit langer Nutzungsdauer
Olga Stark

Olga Stark

Internal Sales for Tools, Machines & Consumables

+49 (0)30 5858428 32
olga.stark@dopa-diatools.com

Jürgen Waidhas

Jürgen Waidhas

Global Sales for Tools and Machines

Mario Patraschkov

Mario Patraschkov

Head of Sales Tools, Machines & Consumables

+49 (0)30 5858428 31
mario@dopa-diatools.com

If you have any questions or would like further information, please do not hesitate to contact us.

WAMP Mounting Film

WAMP Mounting Film

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WAMP Mounting Film

WAMP Films for Secure Workpiece Fixation

dopa WAMP mounting film is used to securely fix parts for single side grinding, lapping, and polishing processes on mounting plates. WAMP is a double-sided adhesive film with a thickness tolerance of only ± 0.001mm. Without preheating the base plate, it can be fast and easily applied, and the components mounted.

Several gluing, cementing, and optical contact bonding processes can be substituted with WAMP. It is primarily used to fix workpieces on mounting plates in single-side grinding, lapping, and polishing applications. The film is compatible with mounting plates made of glass, ceramic, and metal in combination with nearly all types of substrates.

Thanks to WAMP’s very high parallelism and homogeneity, it enables the production of high-precision, parallel components, reduces waxing errors, and ensures stable process results. After processing, the adhesive can be easily deactivated by heating, allowing substrates to be removed without any residue.

The WAMP mounting film has a total thickness of about 0.246 mm (delivery state) and is made of 3 different layers:

LayerDescriptionThickness
1st Layer:Protective film0.036 mm
2nd Layer:WAMP film0.174 mm
3rd Layer:Protective film0.036 mm

WAMP is available in 3 different color-coded release temperatures:

TypeRelease Temperature [°C]
Carbon-black WAMP> 50 °C
Green WAMP> 50 °C
Red WAMP> 80 °C
Purple WAMP> 100 °C

You will find all necessary details how to use WAMP in our tutorial

Benefits of WAMP

  • Easy and fast to apply
  • Precise positioning
  • No adhesive gaps or cementing failures
  • Low release temperatures
  • Fast and easy to remove without residues
    → Can be used to protected very delicate polished surfaces from scratching
    → No need for special cleaning
  • Low thickness tolerance
    → Can be used to process even very thin components (< 0.1 mm)
Olga Stark

Olga Stark

Internal Sales for Tools, Machines & Consumables

+49 (0)30 5858428 32
olga.stark@dopa-diatools.com

Jürgen Waidhas

Jürgen Waidhas

Internal Sales for Tools, Machines & Consumables

Mario Patraschkov

Mario Patraschkov

Head of Sales Tools, Machines & Consumables

+49 (0)30 5858428 31
mario@dopa-diatools.com

If you have any questions or would like further information, please do not hesitate to contact us.

Dressing & Conditioning Tools

Dressing & Conditioning Tools

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Dressing & Conditioning Tools

Dressing & Conditioning Tools

For all our grinding tools and processes as well as our polishing pads and solutions, we are able to supply customized dressing and conditioning tools.

Please contact us for your non-committal consultation.

Benefits of dressing tools for grinding tools:

 

  • Maintains a long lifespan of the grinding tools as the binding is only removal marginally
  • Easy to use
  • No contamination with residues
  • Very quick dressing – and shape correction cycles of usually just a few seconds

Benefits of PU pad dressing & conditioning tools:

  • Extremely high lifespan
  • No scratches from abrasive diamonds or break-offs
  • Very cutting efficient and therefore ensures fast processing and easy shape correction
Olga Stark

Olga Stark

Internal Sales for Tools, Machines & Consumables

+49 (0)30 5858428 32
olga.stark@dopa-diatools.com

Jürgen Waidhas

Jürgen Waidhas

Sales Engineer for Tools, Machines & Consumables

Mario Patraschkov

Mario Patraschkov

Head of Sales Tools, Machines & Consumables

+49 (0)30 5858428 31
mario@dopa-diatools.com

If you have any questions or would like further information, please do not hesitate to contact us.

Flatness & Gap Measuring Systems

Flatness & Gap Measuring Systems

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Flatness & Gap Measuring Systems

Flatness Measurement System

T dopa flatness measuring systems are used to check the flatness of grinding wheels, lapping wheels and polishing pads on micron level. They are very easy to handle and gives you precise information about flatness over the whole diameter. Keeping your wheels and polishing tools flat is crucial for producing flat parts. Knowing the exact shape of your tools is an absolute requirement before making any adjustments. Applying the dopa FMS will improve and stabilize your processes, save cost and enable you producing better parts.

Product content:
1 x precision liner made of stainless steel
2 x precision cylinder made of stainless steel (support for the steel liner)
1 x indicator with stainless steel base (resolution of 2 µm) 1 x calibration protocol of your flatness system

All components are stored in protective boxes to protect the flatness measuring system from environmental influences and physical damage.

Parallelism/Gap Measurement System

The dopa parallelism measuring system can be used on double-side grinding-, lapping- and polishing equipment. It gives you information about parallelism of top and bottom plate as well as waviness over the complete plate diameter with a precision on micron level.

A check is necessary:
1. When grinding-, lapping- or polishing wheels have been changed
2. After sharpening and conditioning process
3. For regular system checks e.g. as part of your preventive maintenance system

Product content:
3 x precision cylinder made from stainless steel (spacer)
1 x indicator with stainless steel base (resolution of 2 µm)

To protect the parallelism measuring system from environmental influences and physical damage all components are stored in protective boxes.

When you keep flatness and parallelism on a good level you will receive a better TTV and better surface quality of your products. Additionally, you save consumables, cost and time.

We recommend you to use the dopa parallelism system together with the dopa flatness measuring system, which is a very easy way to check the flatness of the lower plate. Using both systems you get an even better process control over your equipment and you can ensure reproducible and efficient results of your manufacturing process.

Olga Stark

Olga Stark

Internal Sales for Tools, Machines & Consumables

+49 (0)30 5858428 32
olga.stark@dopa-diatools.com

Jürgen Waidhas

Jürgen Waidhas

Sales Engineer for Tools, Machines & Consumables

Mario Patraschkov

Mario Patraschkov

Head of Sales Tools, Machines & Consumables

+49 (0)30 5858428 31
mario@dopa-diatools.com

If you have any questions or would like further information, please do not hesitate to contact us.

Diamond Slurry

Diamond Slurry

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Diamond Slurry

Diamond slurry for highest surface qualities and excellent MRR

Our diamond slurries are used for polishing various materials, have supreme lubrication properties and do not dry. The diamond particles are excellently dispersed and produce very homogeneous surfaces. In our special formulations the abrasive particles are stabilized to prevent them from settling. This guarantees a highly efficient process.

The diamond grain used in our slurries complies with highest quality standards – from coarse grain sizes for diamond lapping to 0.010 µm nano-diamond slurries for ultra-fine polishing.

Our portfolio of diamond slurries caters for various application:

Typ OSP

For polishing optical glass and crystals on polishing pads, pitch and dopa’s solid polishing pads.

Typ LLCP+

For lapping and polishing of ceramics and ultra-hard materials such as Sapphire, Carbides, Nitrides and Spinel on dopa’s solid polishing pads.

Typ PMC

For fine-polishing of ceramics and ultra-hard materials such as Sapphire, Carbides, Nitrides, Spinel and metals on dopa polishing wheels and pellets.

More

We also offer slurries for polishing metals, ceramics and other brittle materials as well as ultra-fine colloidal polishing slurries.

Olga Stark

Olga Stark

Internal Sales for Tools, Machines & Consumables

+49 (0)30 5858428 32
olga.stark@dopa-diatools.com

Jürgen Waidhas

Jürgen Waidhas

Sales Engineer for Tools, Machines & Consumables

Mario Patraschkov

Mario Patraschkov

Head of Sales Tools, Machines & Consumables

+49 (0)30 5858428 31
mario@dopa-diatools.com

If you have any questions or would like further information, please do not hesitate to contact us.